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Film formation Product List and Ranking from 18 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

Film formation Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. サーマプレシジョン Tokyo//others
  2. DIAM Chiba//Manufacturing and processing contract
  3. 東邦化研 Saitama//Electronic Components and Semiconductors
  4. 4 東製 Chiba//Industrial Machinery
  5. 5 ジオマテック Kanagawa//Industrial Electrical Equipment

Film formation Product ranking

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Conductive diamond coating service DIAM
  2. Next-generation substrate conductor layer formation "PVD device" - World first! Direct copper deposition. サーマプレシジョン
  3. DLC film formation (Diamond-Like Carbon) 東製
  4. New technology currently seeking applications! "Internal Coating of Cylinders" ジオマテック
  5. 4 Plasma CVD film deposition 東邦化研

Film formation Product List

1~15 item / All 22 items

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DLC film formation (Diamond-Like Carbon)

It is a diamond-like carbon that is resistant to wear.

We provide surface treatment processing that allows you to widely utilize the excellent features of diamond-like carbon (DLC) films.

  • Coater

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New technology currently seeking applications! "Internal Coating of Cylinders"

Achieving vacuum film deposition on the inner surface of a cylinder! Coating with a metal thin film enables internal reflection of light within the cylinder and heating through electric current.

■Overview It is possible to form thin films on the inner surface of cylinders up to 1,500 mm in length, which is rare in the world.

  • Sterilizer
  • Separation device
  • Surface treatment contract service

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Contracted film deposition of conductive diamond electrodes.

Oxidation and reduction reactions of substances can be prioritized! Decomposition and synthesis of substances that were impossible with conventional methods can be achieved.

Diamonds are usually insulators, but by doping with boron, they can be made conductive while retaining the chemical stability and strength characteristics of diamonds, allowing for various applications. Due to the wide potential window, oxidation and reduction reactions of substances that are typically difficult to electrolyze can be prioritized, enabling the decomposition and synthesis of substances that were previously impossible with conventional methods. Additionally, we provide conductive diamond electrodes suitable for generating ozone water by optimizing the process conditions and pretreatment during diamond film formation. 【Features】 ■ Prioritization of oxidation and reduction reactions of substances ■ Enables decomposition and synthesis of substances that were previously impossible with conventional methods *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Thin Film Microfabrication "Electrode Film Formation"

Using sputtering technology, we form high-purity, high-precision electrode films! Introducing our thin film microfabrication.

We would like to introduce Shinco's thin film microfabrication technology for 'electrode deposition.' Using sputtering technology, we form high-purity, high-precision electrode films. Magnetic films can be made from Fe/Ta-based materials and high-purity Fe (permalloy), while electrode formation films can be made from Au, Cr, and Ni/Cr. Please inquire about target purity and composition. 【Types of thin films that can be formed using sputtering technology】 ■ Magnetic films: Fe/Ta-based, high-purity Fe (permalloy) ■ Electrode formation films: Au, Cr, Ni/Cr ■ Insulating films: SiO2, Al2O3 *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Information on "Contracted Film Formation Services"

Maximum film formation area 400mmΦ・315mm□! Film deposition of various thin films by sputtering.

We offer contract film deposition of various metal materials, oxide film materials, etc., and we specialize in film deposition on plastic substrates. The usual delivery time is about one week, and patterned film deposition is also possible upon request. First, please let us know the material you wish to deposit and the substrate you will use. Based on your requirements, we will determine the pre-treatment conditions, deposition conditions, film thickness, etc. 【Available Substrates】 ■ Glass ■ Metal ■ Ceramic ■ Si wafers ■ Various plastic materials *For more details, please download the PDF or feel free to contact us.

  • Contract manufacturing
  • Other metal materials
  • Processing Contract

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Film Processing Department

We achieve stable quality and high reliability through film formation in a clean room.

Our company is dedicated to glass processing and currently focuses on ultra-precision polishing as our main business. For reflective films (thin film processing), we conduct thorough quality control from design to film formation, providing metal and multilayer films tailored to specific applications, resulting in higher quality and more reliable products. For ITO films (thin film processing), we offer transparent conductive films that meet various needs, ranging from high resistance to low resistance, with high adhesion and high strength, using deposition and sputtering methods. Additionally, film formation in a clean room ensures stable quality and high reliability. 【Features】 - Thorough quality control from design to film formation for metal and multilayer films tailored to specific applications - Provision of higher quality and more reliable products - Transparent conductive films tailored to needs, ranging from high resistance to low resistance, with high adhesion and high strength, using deposition and sputtering methods *For more details, please refer to the PDF document or feel free to contact us.

  • Glass
  • Processing Contract
  • Contract manufacturing

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Achieving high-level DLC film deposition with proprietary sputtering technology!

DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.

The RAM CATHODE (four-sided opposing cathode) dramatically improves the ionization rate, allowing for the formation of DLC (ta-C) using a DC pulse power supply without the need for HIPIMS power supply. 【Conventional Sputtering Method】 Due to the low ionization rate of carbon, it was necessary to use HIPIMS power supply to forcibly increase the ionization rate in order to obtain the ta-C region. 【RAM Cathode Developed by Our Company】 By arranging targets on four opposing sides, it is possible to enhance the confinement of plasma due to the magnetic field between the targets, resulting in the formation of high-density plasma. Within the confined plasma, the collisions between electrons, rebounding argon, and C flux promote the ionization of Ar ions and C flux, making it easier to form C-C bonds in the DLC film. As a result, we have achieved the formation of high-hardness and high-smoothness DLC without using HIPIMS power supply. *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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Sputtering thin films (films/fibers) contract processing/contract film formation/development

Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.

Introducing the "Sputtering Technology" of Sekisui Nano Coat. We have a proven track record in various applications and functions, with extensive experience in processing a wide range of materials and substrates. We accommodate sputtering processing for unique fibers such as chemical fibers and carbon fibers. Additionally, we own sputtering equipment capable of handling widths up to 3400mm and up to 10 sputtering sources. Please feel free to consult us regarding thin film product development/sales, contract film formation processing, prototypes, and more. 【Features】 ■ Three technical axes: Optical adjustment, conductivity, antibacterial/antiviral ■ Proven track record in various applications/functions ■ Extensive experience in processing various materials and substrates - Materials: Various metals, alloys, compounds; Substrates: Films, metal foils, paper, etc. ■ Sputtering processing for unique fibers - Examples: Chemical fibers, carbon fibers, glass fibers, non-woven fabrics, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment
  • Processing Contract
  • Surface treatment contract service

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Conductive diamond coating service

It is possible to decompose and synthesize substances that were difficult with conventional methods.

We offer conductive diamond coating services. Diamond is typically an insulator, but by doping it with boron, conductivity can be imparted while retaining the chemical stability, strength, and other characteristics of diamond, making it suitable for various applications. Additionally, due to its wide potential window, it can preferentially facilitate oxidation or reduction reactions of substances that are usually difficult to electrolyze, enabling the decomposition and synthesis of materials that were challenging with conventional methods. 【Application Range】 ■ Electrolytic synthesis ■ Electrolysis ■ Sensors *For more details, please download the PDF or feel free to contact us.

  • Company:DIAM
  • Price:Other
  • Other electronic parts
  • Processing Contract

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Providing high hardness DLC (TAC) film through low-temperature film formation.

Attention those troubled by scratches and wear on parts. Hydrogen-free DLC (ta-C) film offers high hardness and high density, providing excellent wear resistance! No deformation of the substrate due to heat.

The hydrogen-free DLC film (ta-C) produced by the Filtered Arc Vacuum Deposition (FCVA) method differs from existing PVD and CVD methods by removing impurities through an electromagnetic filter, resulting in fewer particles, excellent adhesion, and high wear resistance. Additionally, since it is deposited at room temperature, it can be applied to low-melting-point materials such as plastics and rubber, as well as various materials like ceramics. Furthermore, thick films of over 10 micrometers can be created, enhancing the quality and longevity of automotive parts, thereby increasing added value. Not only DLC films, but metal films can also be produced. We also accept contract film deposition and equipment sales. 【Features】 ■ High hardness (~50 GPa) ■ High density ■ High adhesion ■ Wear resistance ■ Low-temperature deposition (<100°C) ■ DLC (ta-C) + decorative films available *For more details, please download the PDF or contact us.

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Providing high hardness DLC (TAC) film through low-temperature film formation.

Are you troubled by scratches and wear on your parts? Hydrogen-free DLC (ta-C) films exhibit high hardness, high density, and excellent wear resistance.

The hydrogen-free DLC film (ta-C) using the Filtered Arc Vacuum Deposition (FCVA) method differs from existing PVD and CVD methods by removing impurities through an electromagnetic filter, resulting in fewer particles, excellent adhesion, and high wear resistance. Additionally, since it is formed at room temperature, it can be deposited on low melting point materials such as plastics and rubber, as well as various materials like ceramics. Furthermore, thick films of over 10 micrometers can be created, enhancing the quality and longevity of automotive parts, thereby increasing added value. Not only DLC films but also metal films can be produced. We also accept contract film deposition and equipment sales. 【Features】 ■ High hardness (~50 GPa) ■ High density ■ High adhesion ■ Wear resistance ■ Low-temperature deposition (<100°C) ■ DLC (ta-C) + decorative films are possible 【Application Fields】 ■ Resin materials, ceramic materials ■ Optical components ■ Automotive parts ■ Printer industry ■ Release films for precision molds used in glass lenses, plastics, etc. We will be exhibiting at the 26th Mechanical Elements Technology Exhibition in Osaka. Venue: Intex Osaka Hall Name: Hall 6A Booth Number: 32-5

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Next-generation substrate conductor layer formation "PVD device" - World first! Direct copper deposition.

Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond conventional levels!

【Features】 ■ Achieves high productivity equivalent to or greater than conventional methods such as electroless plating through a vacuum process. ■ Enables high-density plasma modification treatment using a new plasma source. ■ Allows for a high-adhesion process through direct copper sputtering onto organic insulators and glass. ■ Realizes film formation on high aspect ratio TH and BVH, which is considered difficult with conventional sputtering. ■ Offers overwhelming cost competitiveness in equipment compared to traditional sputtering devices. 【Adhesion Strength (Peel Strength)】 Non-alkali glass: ~10 Quartz: ~7 Epoxy resin: ~6 Polyimide: ~12

  • PVD装置  .jpg
  • Sputtering Equipment

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Sputtering deposition

A film formation technology with excellent reproducibility that utilizes high energy to forge the material itself!

The sputtering method is a technique that involves colliding high-energy particles (argon) generated by plasma with a film-forming material (target), which knocks out the material components and deposits them onto a substrate such as glass or silicon wafers to form a thin film. Our company also offers coating services using the sputtering method, in addition to ion plating and vacuum deposition methods. Currently, the types of films available using the sputtering method are Ti, TiN, and TiC.

  • Processing Contract
  • Wafer
  • Sputtering Equipment

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Plasma CVD film deposition

Forming a dense thin film by chemically reacting gases! Low-temperature processing is also possible.

The plasma CVD method is a technique that involves exciting or decomposing a gas containing the desired elements for the film using plasma, which then adsorbs and reacts on the substrate surface to form a film. Because it uses plasma, it allows for film formation at lower temperatures compared to thermal CVD. Additionally, it is characterized by better conformality on uneven surfaces compared to ion plating, vacuum deposition, and sputtering methods. Our company offers coating services using the plasma CVD method, in addition to ion plating and vacuum deposition methods. Currently, the types of films available using the plasma CVD method are four types: DLC (Diamond-Like Carbon), SiO2, SiN, and SiC.

  • Wafer
  • CVD Equipment
  • Processing Contract

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Ion plating deposition

More than 50 types of thin film coatings available, even for just one piece! Ion plating developed from space development technology.

Ion plating is an advanced version of vacuum deposition. Similar to vacuum deposition, it involves evaporating (or sublimating) the material to be formed into a film in a vacuum and depositing it onto a substrate such as glass or silicon wafers. The characteristic of ion plating is that it passes the evaporated particles through plasma to give them a positive charge, and by applying a negative charge to the substrate side, it attracts the evaporated particles to deposit them on the substrate, thereby forming a thin film. It is possible to impart new functions to components and materials according to their applications. **Features of Ion Plating** - Stronger adhesion than vacuum deposition - Coating at low temperatures is possible (except for a few types of films) - Compatible with a wide range of film types - Diversity in deposition conditions can be achieved - Applicable to reactive films such as oxide films, nitride films, and carbide films - Better film coverage in shadow areas compared to vacuum deposition - Alloy films are possible

  • Processing Contract
  • Other semiconductor manufacturing equipment
  • Surface treatment contract service

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